Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10363608 | Copper paste for joining, method for producing joined body, and method for producing semiconductor device | Yuki KAWANA, Kazuhiko Kurafuchi, Hideo Nakako, Chie Sugama, Dai Ishikawa | 2019-07-30 |