| 10163737 |
Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages |
Kang Chen |
2018-12-25 |
| 10163747 |
Semiconductor device and method of controlling warpage in reconstituted wafer |
Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Kang Chen, Seng Guan Chow |
2018-12-25 |
| 10163815 |
Semiconductor device with dummy metal protective structure around semiconductor die for localized planarization of insulating layer |
Xia Feng, Kang Chen, Jianmin Fang |
2018-12-25 |
| 10141222 |
Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP |
Pandi C. Marimuthu |
2018-11-27 |
| 10115672 |
Double-sided semiconductor package and dual-mold method of making same |
Il Kwon Shim, Pandi C. Marimuthu |
2018-10-30 |
| 10074553 |
Wafer level package integration and method |
— |
2018-09-11 |
| 10049964 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units |
Il Kwon Shim, Pandi C. Marimuthu, Kang Chen, Yu Gu |
2018-08-14 |
| 9997468 |
Integrated circuit packaging system with shielding and method of manufacturing thereof |
Byung Joon Han, Il Kwon Shim, KyoungHee Park, KyoWang Koo, In Sang Yoon +5 more |
2018-06-12 |
| 9978700 |
Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing |
— |
2018-05-22 |
| 9978654 |
Semiconductor device and method of forming dual-sided interconnect structures in Fo-WLCSP |
Kang Chen |
2018-05-22 |
| 9978665 |
Semiconductor device and method of forming low profile fan-out package with vertical interconnection units |
Pandi C. Marimuthu, Il Kwon Shim, Won Kyoung Choi |
2018-05-22 |
| 9941207 |
Semiconductor device and method of fabricating 3D package with short cycle time and high yield |
— |
2018-04-10 |
| 9893017 |
Double-sided semiconductor package and dual-mold method of making same |
Il Kwon Shim, Pandi C. Marimuthu |
2018-02-13 |
| 9875973 |
Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers |
Kang Chen, Yu Gu, Wei Meng, Chee Siang Ong |
2018-01-23 |
| 9875911 |
Semiconductor device and method of forming interposer with opening to contain semiconductor die |
Reza A. Pagaila, Jun Mo Koo, HeeJo Chi |
2018-01-23 |
| 9865482 |
Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component |
Jianmin Fang, Kang Chen, Haijing Cao |
2018-01-09 |
| 9865525 |
Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units |
Pandi C. Marimuthu, Kang Chen, Yu Gu |
2018-01-09 |