| 10159148 |
Porous alumina templates for electronic packages |
Rajesh Katkar, Cyprian Emeka Uzoh, Belgacem Haba |
2018-12-18 |
| 10157978 |
High density three-dimensional integrated capacitors |
Vage Oganesian, Belgacem Haba, Piyush Savalia |
2018-12-18 |
| 10062661 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2018-08-28 |
| 10015881 |
Cavities containing multi-wiring structures and devices |
Cyprian Emeka Uzoh, Craig Mitchell, Belgacem Haba |
2018-07-03 |
| 9984901 |
Method for making a microelectronic assembly having conductive elements |
Belgacem Haba, Teck-Gyu Kang, Ellis Chau |
2018-05-29 |
| 9966303 |
Microelectronic elements with post-assembly planarization |
Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia |
2018-05-08 |
| 9953914 |
Substrate-less stackable package with wire-bond interconnect |
— |
2018-04-24 |
| 9947643 |
Inverted optical device |
Masud Beroz, Liang Wang |
2018-04-17 |
| 9917073 |
Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package |
— |
2018-03-13 |
| 9899353 |
Off-chip vias in stacked chips |
Belgacem Haba, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi |
2018-02-20 |
| 9876002 |
Microelectronic package with stacked microelectronic units and method for manufacture thereof |
Terrence Caskey |
2018-01-23 |
| 9859220 |
Laminated chip having microelectronic element embedded therein |
Vage Oganesian, Craig Mitchell, Belgacem Haba, Piyush Savalia |
2018-01-02 |