Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062661 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2018-08-28 |
| 10032695 | Powermap optimized thermally aware 3D chip package | Madhu Krishnan Iyengar, Christopher G. Malone, Norman Paul Jouppi | 2018-07-24 |
| 9984901 | Method for making a microelectronic assembly having conductive elements | Belgacem Haba, Ilyas Mohammed, Ellis Chau | 2018-05-29 |