Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163808 | Module with embedded side shield structures and method of fabricating the same | Nitesh Kumbhat, Deog Soon Choi | 2018-12-25 |
| 10062661 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Ellis Chau +6 more | 2018-08-28 |
| 9865479 | Method of attaching components to printed cirucuit board with reduced accumulated tolerances | Li Sun, Ashish Alawani, Lea-Teng Lee | 2018-01-09 |