Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163808 | Module with embedded side shield structures and method of fabricating the same | Nitesh Kumbhat, Wei-Shun Wang | 2018-12-25 |
| 10141268 | Circuit package with internal and external shielding | Domingo Figueredo, Husnu Ahmet Masaracioglu, Marshall Maple, Ashish Alawani | 2018-11-27 |
| 10134682 | Circuit package with segmented external shield to provide internal shielding between electronic components | Nitesh Kumbhat, Ashish Alawani, Li Sun | 2018-11-20 |
| 10134686 | Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages | Ah Ron Lee, Young-Ho Lee, Boon Keat Tan, Jin Ho Choi | 2018-11-20 |
| 10076023 | Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages | Chang-Yul Cheon, Sang Hwa Jung, Sung-Phyo Lim, Aaron Lee | 2018-09-11 |
| 9974181 | Module with external shield and back-spill barrier for protecting contact pads | Sarah Haney, Hyun Mo Ku, Lea-Teng Lee, Nitesh Kumbhat, Ah Ron Lee | 2018-05-15 |
| 9972592 | Bumped land grid array | Ah Ron Lee, Hyun Mo Ku | 2018-05-15 |
| 9972590 | Semiconductor package having a solder-on-pad structure | Ah Ron Lee, Hyun Mo Ku | 2018-05-15 |
| 9907169 | Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB | Nitesh Kumbhat, Li Sun, Aaron Lee, Hyun Mo Ku, Jack Ajoian | 2018-02-27 |