Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141268 | Circuit package with internal and external shielding | Domingo Figueredo, Husnu Ahmet Masaracioglu, Deog Soon Choi, Ashish Alawani | 2018-11-27 |
| 9997428 | Via structures for thermal dissipation | Ashish Alawani, Li Sun, Sarah Haney | 2018-06-12 |