Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141268 | Circuit package with internal and external shielding | Domingo Figueredo, Husnu Ahmet Masaracioglu, Marshall Maple, Deog Soon Choi | 2018-11-27 |
| 10134682 | Circuit package with segmented external shield to provide internal shielding between electronic components | Nitesh Kumbhat, Deog Soon Choi, Li Sun | 2018-11-20 |
| 10021790 | Module with internal wire fence shielding | Jin Jeong, Chris Y. Chung, Nitesh Kumbhat | 2018-07-10 |
| 9997428 | Via structures for thermal dissipation | Marshall Maple, Li Sun, Sarah Haney | 2018-06-12 |
| 9865479 | Method of attaching components to printed cirucuit board with reduced accumulated tolerances | Wei-Shun Wang, Li Sun, Lea-Teng Lee | 2018-01-09 |