Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134682 | Circuit package with segmented external shield to provide internal shielding between electronic components | Nitesh Kumbhat, Deog Soon Choi, Ashish Alawani | 2018-11-20 |
| 9997428 | Via structures for thermal dissipation | Marshall Maple, Ashish Alawani, Sarah Haney | 2018-06-12 |
| 9907169 | Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB | Nitesh Kumbhat, Aaron Lee, Deog Soon Choi, Hyun Mo Ku, Jack Ajoian | 2018-02-27 |
| 9865479 | Method of attaching components to printed cirucuit board with reduced accumulated tolerances | Wei-Shun Wang, Ashish Alawani, Lea-Teng Lee | 2018-01-09 |