Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9972590 | Semiconductor package having a solder-on-pad structure | Deog Soon Choi, Ah Ron Lee | 2018-05-15 |
| 9972592 | Bumped land grid array | Ah Ron Lee, Deog Soon Choi | 2018-05-15 |
| 9974181 | Module with external shield and back-spill barrier for protecting contact pads | Sarah Haney, Deog Soon Choi, Lea-Teng Lee, Nitesh Kumbhat, Ah Ron Lee | 2018-05-15 |
| 9907169 | Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB | Nitesh Kumbhat, Li Sun, Aaron Lee, Deog Soon Choi, Jack Ajoian | 2018-02-27 |