Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9907169 | Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB | Nitesh Kumbhat, Li Sun, Aaron Lee, Deog Soon Choi, Hyun Mo Ku | 2018-02-27 |
| 9860985 | System and method for improving isolation in high-density laminated printed circuit boards | — | 2018-01-02 |