Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10076023 | Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages | Deog Soon Choi, Chang-Yul Cheon, Sang Hwa Jung, Sung-Phyo Lim | 2018-09-11 |
| 9907169 | Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB | Nitesh Kumbhat, Li Sun, Deog Soon Choi, Hyun Mo Ku, Jack Ajoian | 2018-02-27 |