Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134686 | Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages | Deog Soon Choi, Young-Ho Lee, Boon Keat Tan, Jin Ho Choi | 2018-11-20 |
| 9972590 | Semiconductor package having a solder-on-pad structure | Deog Soon Choi, Hyun Mo Ku | 2018-05-15 |
| 9972592 | Bumped land grid array | Deog Soon Choi, Hyun Mo Ku | 2018-05-15 |
| 9974181 | Module with external shield and back-spill barrier for protecting contact pads | Sarah Haney, Deog Soon Choi, Hyun Mo Ku, Lea-Teng Lee, Nitesh Kumbhat | 2018-05-15 |