PO

Philip R. Osborn

TE Tessera: 1 patents #8 of 25Top 35%
📍 San Jose, CA: #2,540 of 5,991 inventorsTop 45%
🗺 California: #23,431 of 60,411 inventorsTop 40%
Overall (2018): #275,465 of 503,207Top 55%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10062661 Package-on-package assembly with wire bonds to encapsulation surface Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Wei-Shun Wang, Ellis Chau +6 more 2018-08-28