Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062661 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2018-08-28 |
| 9984901 | Method for making a microelectronic assembly having conductive elements | Belgacem Haba, Teck-Gyu Kang, Ilyas Mohammed | 2018-05-29 |