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Process of filling the high aspect ratio trenches by co-flowing ligands during thermal CVD |
Pramit Manna, Rui Cheng, Kelvin Chan |
2018-11-13 |
| 10083834 |
Methods of forming self-aligned vias |
David Thompson, Benjamin Schmiege, Jeffrey W. Anthis, Susmit Singha Roy, Ziqing Duan |
2018-09-25 |
| 10017856 |
Flowable gapfill using solvents |
Ranga Rao Arnepalli, Darshan Thakare, Pramit Manna, Robert Jan Visser, Prerna Goradia +1 more |
2018-07-10 |
| 10002757 |
Selectively lateral growth of silicon oxide thin film |
Yihong Chen, Kelvin Chan, Shaunak Mukherjee |
2018-06-19 |
| 9991118 |
Hybrid carbon hardmask for lateral hardmask recess reduction |
Thomas Jongwan Kwon, Rui Cheng, Er-Xuan Ping, Jaesoo Ahn |
2018-06-05 |
| 9947576 |
UV-assisted material injection into porous films |
Brian Saxton Underwood |
2018-04-17 |
| 9865459 |
Plasma treatment to improve adhesion between hardmask film and silicon oxide film |
Rui Cheng, Pramit Manna |
2018-01-09 |