Issued Patents 2017
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9633975 | Multi-die wirebond packages with elongated windows | Wael Zohni | 2017-04-25 |
| 9633979 | Microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation | Ilyas Mohammed | 2017-04-25 |
| 9633968 | Microelectronic packages having cavities for receiving microelectronic elements | Ilyas Mohammed, Wael Zohni, Philip R. Osborn | 2017-04-25 |
| 9627366 | Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another | Ilyas Mohammed | 2017-04-18 |
| 9620437 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2017-04-11 |
| 9615451 | Porous alumina templates for electronic packages | Rajesh Katkar, Cyprian Emeka Uzoh, Ilyas Mohammed | 2017-04-04 |
| 9615456 | Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface | Ilyas Mohammed, Terrence Caskey, Reynaldo Co, Ellis Chau | 2017-04-04 |
| 9595511 | Microelectronic packages and assemblies with improved flyby signaling operation | Zhuowen Sun, Javier A. Delacruz | 2017-03-14 |
| 9570416 | Stacked packaging improvements | Craig Mitchell, Masud Beroz | 2017-02-14 |
| 9570382 | Stackable molded microelectronic packages | — | 2017-02-14 |
| 9560773 | Electrical barrier layers | Cyprian Emeka Uzoh, Vage Oganesian, Ilyas Mohammed, Piyush Savalia, Craig Mitchell | 2017-01-31 |
| 9559061 | Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof | Ilyas Mohammed | 2017-01-31 |
| 9553076 | Stackable molded microelectronic packages with area array unit connectors | — | 2017-01-24 |
| 9553071 | Multi-chip package with interconnects extending through logic chip | — | 2017-01-24 |