Issued Patents 2017
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837354 | Hybrid copper structure for advance interconnect usage | Hsiang-Wei Liu, Tai-I Yang, Cheng-Chi Chuang | 2017-12-05 |
| 9837307 | Semiconductor device and process | Hsiang-Lun Kao, Yung-Chih Wang, Yu-Chieh Liao | 2017-12-05 |
| 9805970 | Method for forming deep trench spacing isolation for CMOS image sensors | Tai-I Yang, Jung-I Lin, Ta-Chun Lin, Chen-Jong Wang | 2017-10-31 |
| 9735232 | Method for manufacturing a semiconductor structure having a trench with high aspect ratio | Tai-I Yang, Jheng-Sheng YOU, Chi-Fu Lin | 2017-08-15 |
| 9716035 | Combination interconnect structure and methods of forming same | Tai-I Yang, Yung-Chih Wang, Cheng-Chi Chuang, Chia-Tien Wu | 2017-07-25 |
| 9698242 | Semiconductor arrangement and formation thereof | Tai-I Yang, Wai-Yi Lien, Chih-Hao Wang, Jiun-Peng Wu | 2017-07-04 |
| 9633897 | Air-gap forming techniques for interconnect structures | Tai-I Yang, Cheng-Chi Chuang, Yung-Chih Wang | 2017-04-25 |
| 9607881 | Insulator void aspect ratio tuning by selective deposition | Hsiang-Wei Liu, Yu-Chieh Liao | 2017-03-28 |
| 9595471 | Conductive element structure and method | Tai-I Yang, Hsiang-Wei Liu, Chia-Tien Wu, Hsiang-Huan Lee | 2017-03-14 |
| 9583434 | Metal line structure and method | Hsiang-Lun Kao, Hsiang-Wei Liu, Tai-I Yang, Jian-Hua Chen, Yu-Chieh Liao +1 more | 2017-02-28 |
| 9583383 | Air gap forming techniques based on anodic alumina for interconnect structures | Chia-Tien Wu | 2017-02-28 |
| 9576896 | Semiconductor arrangement and formation thereof | Yu-Chieh Liao, Cheng-Chi Chuang, Tai-I Yang, Yung-Hsu Wu | 2017-02-21 |
| 9564396 | Semiconductor device and process | Hsiang-Lun Kao, Yung-Chih Wang, Yu-Chieh Liao | 2017-02-07 |
| 9559134 | Deep trench spacing isolation for complementary metal-oxide-semiconductor (CMOS) image sensors | Tai-I Yang, Jung-I Lin, Ta-Chun Lin, Chen-Jong Wang | 2017-01-31 |