Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837354 | Hybrid copper structure for advance interconnect usage | Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin | 2017-12-05 |
| 9607881 | Insulator void aspect ratio tuning by selective deposition | Yu-Chieh Liao, Tien-Lu Lin | 2017-03-28 |
| 9595471 | Conductive element structure and method | Tai-I Yang, Chia-Tien Wu, Hsiang-Huan Lee, Tien-Lu Lin | 2017-03-14 |
| 9583434 | Metal line structure and method | Hsiang-Lun Kao, Tai-I Yang, Jian-Hua Chen, Yu-Chieh Liao, Yung-Chih Wang +1 more | 2017-02-28 |