Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837354 | Hybrid copper structure for advance interconnect usage | Hsiang-Wei Liu, Tai-I Yang, Tien-Lu Lin | 2017-12-05 |
| 9761504 | Passivation structure and method of making the same | Kun-Ming Huang, Hsuan-Hui Hung, Ming-Yi Lin | 2017-09-12 |
| 9716035 | Combination interconnect structure and methods of forming same | Tai-I Yang, Yung-Chih Wang, Chia-Tien Wu, Tien-Lu Lin | 2017-07-25 |
| 9633897 | Air-gap forming techniques for interconnect structures | Tai-I Yang, Yung-Chih Wang, Tien-Lu Lin | 2017-04-25 |
| 9576896 | Semiconductor arrangement and formation thereof | Yu-Chieh Liao, Tai-I Yang, Tien-Lu Lin, Yung-Hsu Wu | 2017-02-21 |