Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9835382 | Thermal dissipation module | Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh | 2017-12-05 |
| 9837307 | Semiconductor device and process | Hsiang-Lun Kao, Tien-Lu Lin, Yu-Chieh Liao | 2017-12-05 |
| 9716035 | Combination interconnect structure and methods of forming same | Tai-I Yang, Cheng-Chi Chuang, Chia-Tien Wu, Tien-Lu Lin | 2017-07-25 |
| 9633897 | Air-gap forming techniques for interconnect structures | Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin | 2017-04-25 |
| 9583434 | Metal line structure and method | Hsiang-Lun Kao, Hsiang-Wei Liu, Tai-I Yang, Jian-Hua Chen, Yu-Chieh Liao +1 more | 2017-02-28 |
| 9564396 | Semiconductor device and process | Hsiang-Lun Kao, Tien-Lu Lin, Yu-Chieh Liao | 2017-02-07 |