Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721836 | Structure and formation method of damascene structure | Tai-Yen Peng, Jye-Yen Cheng | 2017-08-01 |
| 9716035 | Combination interconnect structure and methods of forming same | Tai-I Yang, Yung-Chih Wang, Cheng-Chi Chuang, Tien-Lu Lin | 2017-07-25 |
| 9595471 | Conductive element structure and method | Tai-I Yang, Hsiang-Wei Liu, Hsiang-Huan Lee, Tien-Lu Lin | 2017-03-14 |
| 9583383 | Air gap forming techniques based on anodic alumina for interconnect structures | Tien-Lu Lin | 2017-02-28 |