Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9817029 | Test probing structure | Mill-Jer Wang, Ching-Fang Chen, Sandeep Kumar Goel, Chung-Sheng Yuan, Chin-Chou Liu +2 more | 2017-11-14 |
| 9741688 | Method for manufacturing a semiconductor device | Ming-Tsun Lin, Hau Tao | 2017-08-22 |
| 9704766 | Interposers of 3-dimensional integrated circuit package systems and methods of designing the same | Sandeep Kumar Goel, Mill-Jer Wang, Chung-Sheng Yuan, Tom C. Chen, Chin-Chou Liu +1 more | 2017-07-11 |
| 9660017 | Microelectronic package with surface mounted passive element | Chee-Kong Ung, Tzu-Hung Lin, Jia-Wei Fang | 2017-05-23 |
| 9646128 | System and method for validating stacked dies by comparing connections | Ashok Mehta, Stanley John, Kai-Yuan Ting, Sandeep Kumar Goel | 2017-05-09 |
| 9613174 | Common template for electronic article | William Wu Shen, Yun-Han Lee, Chin-Chou Liu, Hsien-Hsin Sean Lee, Chung-Sheng Yuan +2 more | 2017-04-04 |
| 9542517 | Techniques for fast resonance convergence | — | 2017-01-10 |