Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9646128 | System and method for validating stacked dies by comparing connections | Stanley John, Kai-Yuan Ting, Sandeep Kumar Goel, Chao-Yang Yeh | 2017-05-09 |
| 9625971 | System and method of adaptive voltage frequency scaling | Kai-Yuan Ting, Sandeep Kumar Goel | 2017-04-18 |
| 9612277 | System and method for functional verification of multi-die 3D ICs | Stanley John, Sandeep Kumar Goel, Kai-Yuan Ting | 2017-04-04 |
| 9552448 | Method and apparatus for electronic system model generation | — | 2017-01-24 |