Issued Patents 2017
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9835680 | Method, device and computer program product for circuit testing | Sandeep Kumar Goel, Saman M. I. Adham | 2017-12-05 |
| 9830413 | System and method for estimating performance, power, area and cost (PPAC) | Sandeep Kumar Goel, Tze-Chiang Huang | 2017-11-28 |
| 9817029 | Test probing structure | Mill-Jer Wang, Ching-Fang Chen, Sandeep Kumar Goel, Chung-Sheng Yuan, Chao-Yang Yeh +2 more | 2017-11-14 |
| 9811627 | Method of component partitions on system on chip and device thereof | Yung-Chin Hou, Sandeep Kumar Goel | 2017-11-07 |
| 9779990 | Integrated antenna on interposer substrate | Bo-Jr Huang, William Wu Shen, Chin-Her Chien, Chin-Chou Liu | 2017-10-03 |
| 9754838 | Semiconductor arrangement and formation thereof | I-Wen Wu, Hsien-Cheng Wang, Mei-Yun Wang, Shih-Wen Liu, Chao-Hsun Wang | 2017-09-05 |
| 9704766 | Interposers of 3-dimensional integrated circuit package systems and methods of designing the same | Sandeep Kumar Goel, Mill-Jer Wang, Chung-Sheng Yuan, Tom C. Chen, Chao-Yang Yeh +1 more | 2017-07-11 |
| 9697319 | System and method for designing cell rows | Wu-An Kuo | 2017-07-04 |
| 9686865 | Networking packages based on interposers | Mark Shane Peng, Shyh-An Chi | 2017-06-20 |
| 9647028 | Wafer on wafer stack method of forming and method of using the same | Sandeep Kumar Goel | 2017-05-09 |
| 9633147 | Power state coverage metric and method for estimating the same | Stanley John, Sandeep Kumar Goel, Tze-Chiang Huang | 2017-04-25 |
| 9627365 | Tri-layer CoWoS structure | Chen-Hua Yu, Shang-Yun Hou | 2017-04-18 |
| 9613174 | Common template for electronic article | William Wu Shen, Chin-Chou Liu, Hsien-Hsin Sean Lee, Chung-Sheng Yuan, Chao-Yang Yeh +2 more | 2017-04-04 |