Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704766 | Interposers of 3-dimensional integrated circuit package systems and methods of designing the same | Sandeep Kumar Goel, Mill-Jer Wang, Chung-Sheng Yuan, Chao-Yang Yeh, Chin-Chou Liu +1 more | 2017-07-11 |