Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9817029 | Test probing structure | Mill-Jer Wang, Ching-Fang Chen, Sandeep Kumar Goel, Chao-Yang Yeh, Chin-Chou Liu +2 more | 2017-11-14 |
| 9704766 | Interposers of 3-dimensional integrated circuit package systems and methods of designing the same | Sandeep Kumar Goel, Mill-Jer Wang, Tom C. Chen, Chao-Yang Yeh, Chin-Chou Liu +1 more | 2017-07-11 |
| 9613174 | Common template for electronic article | William Wu Shen, Yun-Han Lee, Chin-Chou Liu, Hsien-Hsin Sean Lee, Chao-Yang Yeh +2 more | 2017-04-04 |