Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679830 | Semiconductor package | Tzu-Hung Lin | 2017-06-13 |
| 9660017 | Microelectronic package with surface mounted passive element | Chao-Yang Yeh, Chee-Kong Ung, Tzu-Hung Lin | 2017-05-23 |
| 9589092 | Method for co-designing flip-chip and interposer | Chi-Jih Shih, Shen-Yu Huang | 2017-03-07 |
| 9552452 | Method and apparatus for flip chip packaging co-design and co-designed flip chip package | Shen-Yu Huang | 2017-01-24 |