| 9786560 |
Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same |
Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang |
2017-10-10 |
| 9786632 |
Semiconductor package structure and method for forming the same |
Ching-Wen Hsiao, I-Hsuan Peng |
2017-10-10 |
| 9781171 |
Registration method for managing NAT shutdown |
Shaw Hwa Hwang, Cheng Yu YEH, Kuan-Lin Chen, Yao Hsing CHUNG, Chi Jung HUANG +6 more |
2017-10-03 |
| 9711488 |
Semiconductor package assembly |
Ching-Wen Hsiao, I-Hsuan Peng |
2017-07-18 |
| 9704836 |
Semiconductor package assembly |
I-Hsuan Peng, Ching-Wen Hsiao |
2017-07-11 |
| 9679830 |
Semiconductor package |
Jia-Wei Fang |
2017-06-13 |
| 9679842 |
Semiconductor package assembly |
Ming-Tzong Yang, Wei-Che Huang |
2017-06-13 |
| 9660017 |
Microelectronic package with surface mounted passive element |
Chao-Yang Yeh, Chee-Kong Ung, Jia-Wei Fang |
2017-05-23 |
| 9659893 |
Semiconductor package |
Ching-Liou Huang, Thomas Matthew Gregorich |
2017-05-23 |
| 9640505 |
Semiconductor package with trace covered by solder resist |
Ching-Liou Huang, Thomas Matthew Gregorich |
2017-05-02 |
| 9633936 |
Semiconductor package |
Wen-Sung Hsu, Ta-Jen Yu |
2017-04-25 |
| 9620580 |
Semiconductor structure |
Cheng-Chou Hung |
2017-04-11 |
| 9609211 |
Method of image conversion operation for panorama dynamic IP camera |
Shaw Hwa Hwang, Bing Chih YAO, Kuan-Lin Chen, Yao Hsing CHUNG, Chi Jung HUANG +6 more |
2017-03-28 |
| 9607951 |
Chip package |
Uming Ko, Tai-Yu Chen |
2017-03-28 |
| 9570399 |
Semiconductor package assembly with through silicon via interconnect |
Ming-Tzong Yang, Cheng-Chou Hung, Wei-Che Huang, Yu-Hua Huang, Kuei-Ti Chan +2 more |
2017-02-14 |
| 9553040 |
Semiconductor package |
Wen-Sung Hsu, Ta-Jen Yu |
2017-01-24 |
| 9548271 |
Semiconductor package |
Kuei-Ti Chan, Ching-Liou Huang |
2017-01-17 |
| 9548289 |
Semiconductor package assemblies with system-on-chip (SOC) packages |
Ming-Tzong Yang |
2017-01-17 |
| 9543232 |
Semiconductor package structure and method for forming the same |
Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang |
2017-01-10 |