Issued Patents 2017
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786560 | Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same | Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang | 2017-10-10 |
| 9786632 | Semiconductor package structure and method for forming the same | Ching-Wen Hsiao, I-Hsuan Peng | 2017-10-10 |
| 9781171 | Registration method for managing NAT shutdown | Shaw Hwa Hwang, Cheng Yu YEH, Kuan-Lin Chen, Yao Hsing CHUNG, Chi Jung HUANG +6 more | 2017-10-03 |
| 9711488 | Semiconductor package assembly | Ching-Wen Hsiao, I-Hsuan Peng | 2017-07-18 |
| 9704836 | Semiconductor package assembly | I-Hsuan Peng, Ching-Wen Hsiao | 2017-07-11 |
| 9679830 | Semiconductor package | Jia-Wei Fang | 2017-06-13 |
| 9679842 | Semiconductor package assembly | Ming-Tzong Yang, Wei-Che Huang | 2017-06-13 |
| 9660017 | Microelectronic package with surface mounted passive element | Chao-Yang Yeh, Chee-Kong Ung, Jia-Wei Fang | 2017-05-23 |
| 9659893 | Semiconductor package | Ching-Liou Huang, Thomas Matthew Gregorich | 2017-05-23 |
| 9640505 | Semiconductor package with trace covered by solder resist | Ching-Liou Huang, Thomas Matthew Gregorich | 2017-05-02 |
| 9633936 | Semiconductor package | Wen-Sung Hsu, Ta-Jen Yu | 2017-04-25 |
| 9620580 | Semiconductor structure | Cheng-Chou Hung | 2017-04-11 |
| 9609211 | Method of image conversion operation for panorama dynamic IP camera | Shaw Hwa Hwang, Bing Chih YAO, Kuan-Lin Chen, Yao Hsing CHUNG, Chi Jung HUANG +6 more | 2017-03-28 |
| 9607951 | Chip package | Uming Ko, Tai-Yu Chen | 2017-03-28 |
| 9570399 | Semiconductor package assembly with through silicon via interconnect | Ming-Tzong Yang, Cheng-Chou Hung, Wei-Che Huang, Yu-Hua Huang, Kuei-Ti Chan +2 more | 2017-02-14 |
| 9553040 | Semiconductor package | Wen-Sung Hsu, Ta-Jen Yu | 2017-01-24 |
| 9548271 | Semiconductor package | Kuei-Ti Chan, Ching-Liou Huang | 2017-01-17 |
| 9548289 | Semiconductor package assemblies with system-on-chip (SOC) packages | Ming-Tzong Yang | 2017-01-17 |
| 9543232 | Semiconductor package structure and method for forming the same | Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang | 2017-01-10 |