Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786632 | Semiconductor package structure and method for forming the same | Tzu-Hung Lin, Ching-Wen Hsiao | 2017-10-10 |
| 9711488 | Semiconductor package assembly | Tzu-Hung Lin, Ching-Wen Hsiao | 2017-07-18 |
| 9704836 | Semiconductor package assembly | Tzu-Hung Lin, Ching-Wen Hsiao | 2017-07-11 |