Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852973 | Manufacturing method of chip package and package substrate | Ta-Jen Yu | 2017-12-26 |
| 9761534 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Shih-Chin Lin, Tao Cheng, Andrew C. Chang | 2017-09-12 |
| 9633936 | Semiconductor package | Tzu-Hung Lin, Ta-Jen Yu | 2017-04-25 |
| 9627311 | Chip package, package substrate and manufacturing method thereof | Ta-Jen Yu | 2017-04-18 |
| 9597752 | Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof | Tao Cheng, Shih-Chin Lin | 2017-03-21 |
| 9553040 | Semiconductor package | Tzu-Hung Lin, Ta-Jen Yu | 2017-01-24 |