Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761534 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Wen-Sung Hsu, Tao Cheng, Andrew C. Chang | 2017-09-12 |
| 9673145 | Semiconductor integrated circuit layout structure | Kuei-Chun Hung, Jerry Hu, Ming-Jui Chen, Chen-Hsien Hsu | 2017-06-06 |
| 9653346 | Integrated FinFET structure having a contact plug pitch larger than fin and first metal pitch | Kuei-Chun Hung, Jerry Hu, Ming-Jui Chen, Chen-Hsien Hsu | 2017-05-16 |
| 9597752 | Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof | Tao Cheng, Wen-Sung Hsu | 2017-03-21 |
| 9571079 | Integrated circuit and signal monitoring method thereof | Yu-Yee Liow, Ya-Nan Mou, Yuan-Hui Chen, Po-Hua Chen, Wen-Hong Hsu | 2017-02-14 |