| 9786560 |
Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same |
Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin |
2017-10-10 |
| 9712130 |
Passive device cell and fabrication process thereof |
Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang |
2017-07-18 |
| 9679842 |
Semiconductor package assembly |
Wei-Che Huang, Tzu-Hung Lin |
2017-06-13 |
| 9640489 |
Seal ring structure with capacitor |
Cheng-Chou Hung, Tung-Hsing Lee, Yu-Hua Huang |
2017-05-02 |
| 9607894 |
Radio-frequency device package and method for fabricating the same |
Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang |
2017-03-28 |
| 9570399 |
Semiconductor package assembly with through silicon via interconnect |
Cheng-Chou Hung, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin, Kuei-Ti Chan +2 more |
2017-02-14 |
| 9548289 |
Semiconductor package assemblies with system-on-chip (SOC) packages |
Tzu-Hung Lin |
2017-01-17 |
| 9543232 |
Semiconductor package structure and method for forming the same |
Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin |
2017-01-10 |