Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9570399 | Semiconductor package assembly with through silicon via interconnect | Ming-Tzong Yang, Cheng-Chou Hung, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin +2 more | 2017-02-14 |
| 9548271 | Semiconductor package | Tzu-Hung Lin, Ching-Liou Huang | 2017-01-17 |