Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786560 | Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same | Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Wei-Che Huang, Tzu-Hung Lin | 2017-10-10 |
| 9640489 | Seal ring structure with capacitor | Cheng-Chou Hung, Tung-Hsing Lee, Ming-Tzong Yang | 2017-05-02 |
| 9607894 | Radio-frequency device package and method for fabricating the same | Ming-Tzong Yang, Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang | 2017-03-28 |
| 9570399 | Semiconductor package assembly with through silicon via interconnect | Ming-Tzong Yang, Cheng-Chou Hung, Wei-Che Huang, Tzu-Hung Lin, Kuei-Ti Chan +2 more | 2017-02-14 |
| 9543232 | Semiconductor package structure and method for forming the same | Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Wei-Che Huang, Tzu-Hung Lin | 2017-01-10 |