Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9589092 | Method for co-designing flip-chip and interposer | Jia-Wei Fang, Chi-Jih Shih | 2017-03-07 |
| 9552452 | Method and apparatus for flip chip packaging co-design and co-designed flip chip package | Jia-Wei Fang | 2017-01-24 |