Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754898 | Semiconductor package and fabrication method thereof | Mu-Hsuan Chan, Wan-Ting Chen, Chun-Tang Lin | 2017-09-05 |
| 9720013 | Method of fabricating a semiconductor package | Pin-Cheng Huang | 2017-08-01 |
| 9666536 | Package structure and fabrication method thereof | Yi-Wei Liu, Yan-Heng Chen, Mao-Hua Yeh, Hung-Wen Liu | 2017-05-30 |
| 9627226 | Fabrication method of semiconductor package | Chun-Tang Lin | 2017-04-18 |
| 9607974 | Package structure and fabrication method thereof | Chun-Tang Lin, Shih-Ching Chen, Hong-Da Chang, Hung-Wen Liu, Yi-Wei Liu +1 more | 2017-03-28 |
| 9607939 | Semiconductor package and method of fabricating the same | Wen-Tsung Tseng, Shih-Kuang Chiu, Mao-Hua Yeh | 2017-03-28 |
| 9548220 | Method of fabricating semiconductor package having an interposer structure | Kuan-Wei Chuang, Chun-Tang Lin, Yi-Chian Liao | 2017-01-17 |