Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666536 | Package structure and fabrication method thereof | Yi-Wei Liu, Yan-Heng Chen, Mao-Hua Yeh, Yi-Che Lai | 2017-05-30 |
| 9607974 | Package structure and fabrication method thereof | Chun-Tang Lin, Shih-Ching Chen, Yi-Che Lai, Hong-Da Chang, Yi-Wei Liu +1 more | 2017-03-28 |