Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659806 | Semiconductor package having conductive pillars | Shih-Kuang Chiu | 2017-05-23 |
| 9607974 | Package structure and fabrication method thereof | Chun-Tang Lin, Shih-Ching Chen, Yi-Che Lai, Hung-Wen Liu, Yi-Wei Liu +1 more | 2017-03-28 |