Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754868 | Substrate structure, electronic package and method for fabricating the electronic package | Ching-Wen Chiang, Hsin-Chih Wang, Chih-Yuan Shih | 2017-09-05 |
| 9735075 | Electronic module and fabrication method thereof | Lu-Yi Chen, Chang-Lun Lu | 2017-08-15 |
| 9607974 | Package structure and fabrication method thereof | Chun-Tang Lin, Yi-Che Lai, Hong-Da Chang, Hung-Wen Liu, Yi-Wei Liu +1 more | 2017-03-28 |
| 9601403 | Electronic package and fabrication method thereof | Lu-Yi Chen, Guang-Hwa Ma, Chang-Lun Lu | 2017-03-21 |