Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831191 | Electronic package, semiconductor substrate of the electronic package, and method for manufacturing the electronic package | Chieh-Lung Lai, Mao-Hua Yeh, Hung-Yuan Li, Shih-Liang Peng | 2017-11-28 |
| 9818635 | Carrier structure, packaging substrate, electronic package and fabrication method thereof | Lu-Yi Chen | 2017-11-14 |
| 9735075 | Electronic module and fabrication method thereof | Lu-Yi Chen, Shih-Ching Chen | 2017-08-15 |
| 9601403 | Electronic package and fabrication method thereof | Lu-Yi Chen, Guang-Hwa Ma, Shih-Ching Chen | 2017-03-21 |