Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831191 | Electronic package, semiconductor substrate of the electronic package, and method for manufacturing the electronic package | Chieh-Lung Lai, Hung-Yuan Li, Shih-Liang Peng, Chang-Lun Lu | 2017-11-28 |
| 9666536 | Package structure and fabrication method thereof | Yi-Wei Liu, Yan-Heng Chen, Hung-Wen Liu, Yi-Che Lai | 2017-05-30 |
| 9607939 | Semiconductor package and method of fabricating the same | Wen-Tsung Tseng, Yi-Che Lai, Shih-Kuang Chiu | 2017-03-28 |