Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842758 | Package structure and fabrication method thereof | Chun-Tang Lin, Chieh-Yuan Chi | 2017-12-12 |
| 9768140 | Method for fabricating package structure | Mu-Hsuan Chan, Chieh-Yuan Chi | 2017-09-19 |
| 9666536 | Package structure and fabrication method thereof | Yi-Wei Liu, Mao-Hua Yeh, Hung-Wen Liu, Yi-Che Lai | 2017-05-30 |
| 9607941 | Conductive via structure and fabrication method thereof | Chun-Tang Lin, Chieh-Yuan Chi, Mu-Hsuan Chan | 2017-03-28 |
| 9589841 | Electronic package and fabrication method thereof | Yi-Feng Chang | 2017-03-07 |
| 9548219 | Semiconductor package and fabrication method thereof and carrier structure | Chung-Tang Lin, Chieh-Yuan Chi | 2017-01-17 |