Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754927 | Method for fabricating multi-chip stack structure | Chung-Lun Liu, Jung-Pin Huang, Chin-Huang Chang | 2017-09-05 |
| 9666575 | Semiconductor arrangement facilitating enhanced thermo-conduction | Ming-Hsiang Song, Jam-Wem Lee, Wun-Jie Lin | 2017-05-30 |
| 9601627 | Diode structure compatible with FinFET process | Tsung-Che Tsai, Jam-Wem Lee | 2017-03-21 |
| 9589841 | Electronic package and fabrication method thereof | Yan-Heng Chen | 2017-03-07 |
| 9548367 | Method of reducing the heights of source-drain sidewall spacers of FinFETs through etching and the FinFETs thereof | Jam-Wem Lee, Tsung-Che Tsai | 2017-01-17 |