Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842758 | Package structure and fabrication method thereof | Yan-Heng Chen, Chieh-Yuan Chi | 2017-12-12 |
| 9754898 | Semiconductor package and fabrication method thereof | Mu-Hsuan Chan, Wan-Ting Chen, Yi-Che Lai | 2017-09-05 |
| 9627226 | Fabrication method of semiconductor package | Yi-Che Lai | 2017-04-18 |
| 9607941 | Conductive via structure and fabrication method thereof | Yan-Heng Chen, Chieh-Yuan Chi, Mu-Hsuan Chan | 2017-03-28 |
| 9607974 | Package structure and fabrication method thereof | Shih-Ching Chen, Yi-Che Lai, Hong-Da Chang, Hung-Wen Liu, Yi-Wei Liu +1 more | 2017-03-28 |
| 9548220 | Method of fabricating semiconductor package having an interposer structure | Kuan-Wei Chuang, Yi-Chian Liao, Yi-Che Lai | 2017-01-17 |