Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9548220 | Method of fabricating semiconductor package having an interposer structure | Kuan-Wei Chuang, Chun-Tang Lin, Yi-Che Lai | 2017-01-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9548220 | Method of fabricating semiconductor package having an interposer structure | Kuan-Wei Chuang, Chun-Tang Lin, Yi-Che Lai | 2017-01-17 |