Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768140 | Method for fabricating package structure | Yan-Heng Chen, Chieh-Yuan Chi | 2017-09-19 |
| 9754898 | Semiconductor package and fabrication method thereof | Wan-Ting Chen, Chun-Tang Lin, Yi-Che Lai | 2017-09-05 |
| 9607941 | Conductive via structure and fabrication method thereof | Yan-Heng Chen, Chun-Tang Lin, Chieh-Yuan Chi | 2017-03-28 |