Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842758 | Package structure and fabrication method thereof | Yan-Heng Chen, Chun-Tang Lin | 2017-12-12 |
| 9768140 | Method for fabricating package structure | Yan-Heng Chen, Mu-Hsuan Chan | 2017-09-19 |
| 9607941 | Conductive via structure and fabrication method thereof | Yan-Heng Chen, Chun-Tang Lin, Mu-Hsuan Chan | 2017-03-28 |
| 9548219 | Semiconductor package and fabrication method thereof and carrier structure | Yan-Heng Chen, Chung-Tang Lin | 2017-01-17 |