Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812340 | Method of fabricating semiconductor package having semiconductor element | Chiang-Cheng Chang, Meng-Tsung Lee, Jung-Pang Huang, Fu-Tang Huang | 2017-11-07 |
| 9659806 | Semiconductor package having conductive pillars | Hong-Da Chang | 2017-05-23 |
| 9607939 | Semiconductor package and method of fabricating the same | Wen-Tsung Tseng, Yi-Che Lai, Mao-Hua Yeh | 2017-03-28 |