Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9838774 | Headset apparatus | Chun-Yuan Lee, Tsu-Jung Wang, Chien-Min Yao | 2017-12-05 |
| 9831191 | Electronic package, semiconductor substrate of the electronic package, and method for manufacturing the electronic package | Chieh-Lung Lai, Mao-Hua Yeh, Shih-Liang Peng, Chang-Lun Lu | 2017-11-28 |